After more than 20 years of working for Semiconductor vendors and EDA tools companies, Herb Reiter founded his own company, eda 2 asic Consulting, Inc., in 2002 to contribute, as business development consultant, to bridging the gap between eda Design Tools Vendors and asic Semiconductor Companies.
In the meantime the focus of eda 2 asic has moved on from working on single-die asic solutions to integrating multiple dies into an IC package and to bridging the currently many gaps between the partners in this complex and rapidly emerging multi-die IC EcoSystem.
Our industry enjoyed the benefits of continued feature size shrinking for 5 decades. However, following Moore's Law to 10 nm features and below, is no longer economical for most IC applications. New IC technologies are needed to economically and timely serve many markets. Multi-die ICs (a.k.a. 2.5D & 3D-ICs) are a promising alternative versus following Moore's Law of continued shrinking. They have already proven their value in a number of applications. A fewmulti-die IC designs are scheduled to ramp into high-volume production in 2016 and will help maturing the multi-die EcoSystem, lower cost and time to profit.
eda 2 asic assists customers in the transition to this new technology in the parter selection and suggests how to fully utlize the many benefits combining multiple dies into one IC package offers.
eda 2 asic Consulting also works with many companies in the multi-die IC supply chain, introduces them to potential customers and assists in developing user-friendly enabling technologies, as a foundation for faster, smarter, smaller, lower power and lower cost ICs and electronic systems, using
- interposer-based ICs, a.k.a. 2.5D-ICs,
- ICs with vertically-stacked heterogeneous dies and memory cubes, a.k.a. 3D-ICs,
- advanced multi-die packaging solutions, a.k.a. FO-WLP like InFO, SLIM, SWIFT,...
eda 2 asic Consulting assists companies who want to utilize 2.5D-ICs, 3D-ICs or similar multi-die ICs to find the most appropriate technology solution and partners within the complex 3D-IC EcoSystem.
Vice versa, eda 2 asic works with companies who supply materials, building blocks, design- or manufacturing services for these technologies and interoduces them and their value propositions to decision makers at potential customers.
eda 2 asic is also very active in organizing and/or moderating multi-die IC focused portions of industry events. In addition, Herb frequently blogs about 3D-IC EcoSystem news at 3D InCites. See many of Herb's blogs at 3D In Context